feb. 2009 1 CM75RL-12NF application ac drive inverters & servo controls, etc mitsubishi igbt modules CM75RL-12NF high power switching use ? i c ..................................................................... 75a ? v ces ............................................................ 600v ? insulated type ? 7-elements in a pack outline drawing & circuit diagram dimensions in mm b np uvw cn 8 1 1 1 1 up vp wp 2-5.5 mounting holes 55 11.75 32 (13.5) 106 0.5 13.62 7 17 17 40.78 120 11 6-m5 nuts 35 (19.75) 10.75 22 23 23 23 16 3 23.2 12 22 (screwing depth) 12 12 12 12 12 ab 12 +1 ?.5 label housing type of a and b (j.s.t.mfg.co.ltd) a = b8p-vh-fb-b, b = b2p-vh-fb-b p bu n cn-7 cn-8 cn-5 cn-6 up-1 up-2 v cn-3 cn-4 vp-1 vp-2 w cn-1 cn-2 wp-1 wp-2 circuit diagram
feb. 2009 2 600 20 75 150 75 150 430 mitsubishi igbt modules CM75RL-12NF high power switching use v v a a a a w collector-emitter voltage gate-emitter voltage maximum collector dissipation g-e short c-e short dc, t c = 102 c *1 pulse (note 2) pulse (note 2) t c = 25 c symbol parameter collector current emitter current conditions unit ratings v ces v ges i c i cm i e ( note 1 ) i em ( note 1 ) p c ( note 3 ) absolute maximum ratings (tj = 25 c, unless otherwise specified) inverter part 600 20 50 100 320 600 50 v v a a w v a collector-emitter voltage gate-emitter voltage maximum collector dissipation repetitive peak reverse voltage forward current g-e short c-e short dc, t c = 107 c *1 pulse (note 2) t c = 25 c clamp diode part clamp diode part symbol parameter collector current conditions unit ratings v ces v ges i c i cm p c ( note 3 ) v rrm i fm brake part ?0 ~ +150 ?0 ~ +125 2500 2.5 ~ 3.5 2.5 ~ 3.5 350 c c v rms n ?m n ?m g junction temperature storage temperature isolation voltage t orque strength w eight terminals to base plate, f = 60hz, ac 1 minute main terminals m5 screw mounting m5 screw t ypical value symbol parameter conditions unit ratings t j t stg v iso (common rating)
feb. 2009 3 v ce = v ces , v ge = 0v v ge = v ges , v ce = 0v v cc = 300v, i c = 50a, v ge = 15v i f = 50a igbt part *1 clamp diode part *1 i c = 7.5ma, v ce = 10v i c = 75a, v ge = 15v v ce = 10v v ge = 0v v ce = v ces , v ge = 0v v ge = v ges , v ce = 0v v cc = 300v, i c = 75a, v ge = 15v v cc = 300v, i c = 75a v ge = 15v r g = 8.3 ? , inductive load i e = 75a i e = 75a, v ge = 0v igbt part (1/6 module) *1 fwdi part (1/6 module) *1 case to heat sink, thermal compound applied (1/6 module) *2 mitsubishi igbt modules CM75RL-12NF high power switching use 1 0.5 2.2 1 1.3 1.4 0.45 120 100 300 300 100 2.8 0.29 0.51 83 ma a nf nf nf nc ns ns ns ns c v k/w k/w k/w ? 1.7 1.7 300 1.2 0.085 8.3 7v v 68 ns collector cutoff current gate leakage current input capacitance output capacitance reverse transfer capacitance t otal gate charge t urn-on delay time t urn-on rise time turn -off delay time t urn-off fall time reverse recovery time reverse recovery charge emitter-collector voltage contact thermal resistance external gate resistance gate-emitter threshold voltage collector-emitter saturation voltage thermal resistance i ces i ges c ies c oes c res q g t d(on) t r t d(off) t f t rr ( note 1 ) q rr ( note 1 ) v ec( note 1 ) r th(j-c) q r th(j-c) r r th(c-f) r g symbol parameter v ge(th) v ce(sat) unit t yp. limits min. max. test conditions electrical characteristics (tj = 25 c, unless otherwise specified) inverter part i c = 5.0ma i c = 50a, v ge = 15v v ce = 10v v ge = 0v 1 0.5 2.2 7.5 1.0 0.3 2.8 0.39 0.70 130 ma a nf nf nf nc v k/w k/w ? 1.7 1.7 200 13 7v v 68 collector cutoff current gate leakage current input capacitance output capacitance reverse transfer capacitance t otal gate charge forward voltage drop thermal resistance external gate resistance gate-emitter threshold voltage collector-emitter saturation voltage i ces i ges c ies c oes c res q g v fm r th(j-c) q r th(j-c) r r g symbol parameter v ge(th) v ce(sat) * 1 : case temperature (tc) measured point is just under the chips. if you use this value, r th(f-a) should be measured just under the chips. * 2 : typical value is measured by using thermally conductive grease of = 0.9[w/(m ?k)]. note 1. i e , v ec , t rr & q rr represent characteristics of the anti-parallel, emitter-collector free-wheel diode (fwdi). 2. pulse width and repetition rate should be such that the device junction temperature (t j ) does not exceed t jmax rating. 3. junction temperature (t j ) should not increase beyond 150 c. 4. pulse width and repetition rate should be such as to cause negligible temperature rise. unit t yp. limits min. max. test conditions brake part t j = 25 c t j = 125 c t j = 25 c t j = 125 c
feb. 2009 4 mitsubishi igbt modules CM75RL-12NF high power switching use performance curves output characteristics (typical) collector current i c (a) collector-emitter voltage v ce (v) t j = 25c 11 12 10 9 8 v ge = 20v 15 13 collector-emitter saturation voltage characteristics (typical) collector-emitter saturation voltage v ce (sat) (v) collector current i c (a) v ge = 15v t j = 25c t j = 125c 10 8 6 4 2 0 20 12 14 6810 16 18 gate-emitter voltage v ge (v) collector-emitter saturation voltage characteristics (typical) collector-emitter saturation voltage v ce (sat) (v) t j = 25c i c = 75a i c = 150a i c = 30a 10 1 2 3 5 7 10 2 2 3 5 7 10 3 012 4 35 free-wheel diode forward characteristics (typical) emitter current i e (a) emitter-collector voltage v ec (v) t j = 25c t j = 125c 10 ? 2 3 5 7 2 3 5 7 2 3 5 7 10 2 10 1 10 0 10 ? 2 10 0 357 2 10 1 357 2 10 2 357 capacitance? ce characteristics (typical) capacitance c ies , c oes , c res (nf) collector-emitter voltage v ce (v) c ies c oes c res v ge = 0v 10 0 10 1 2 3 5 7 10 2 2 3 5 7 10 3 2 3 5 7 10 0 10 1 57 10 2 23 57 23 half-bridge switching characteristics (typical) switching time (ns) collector current i c (a) conditions: v cc = 300v v ge = 15v r g = 8.3? t j = 125c inductive load t d(off) t d(on) t f t r 50 100 150 0246810 0 4 3 2 1 0 100 50 150 0
feb. 2009 5 mitsubishi igbt modules CM75RL-12NF high power switching use 10 0 10 1 23 57 10 2 23 57 10 1 10 2 2 3 5 7 10 3 2 3 5 7 t rr i rr reverse recovery characteristics of free-wheel diode (typical) emitter current i e (a) reverse recovery time t rr (ns) reverse recovery current l rr (a) conditions: v cc = 300v v ge = 15v r g = 8.3? t j = 25c inductive load 10 ? 10 0 10 ? 10 ? 10 ? 10 0 7 5 3 2 10 ? 7 5 3 2 10 ? 7 5 3 2 10 ? 23 57 23 57 23 57 23 57 10 1 10 ? 10 ? 10 0 10 ? 10 ? 7 5 3 2 10 ? 7 5 3 2 10 ? 23 57 23 57 single pulse, t c = 25c under the chip transient thermal impedance characteristics (igbt part & fwdi part) normalized transient thermal impedance z th (j?) (ratio) time (s) igbt part: per unit base = r th(j c) = 0.29k / w fwdi part: per unit base = r th(j c) = 0.51k / w 10 ? 2 3 5 7 2 3 5 7 10 0 10 1 57 10 2 23 57 23 recovery loss vs. i e (typical) recovery loss (mj/pulse) emitter current i e (a) conditions: v cc = 300v v ge = 15v r g = 8.3? t j = 125c inductive load c snubber at bus err 10 1 10 0 10 ? 2 3 5 7 2 3 5 7 10 0 10 1 57 10 2 23 57 23 switching loss vs. collector current (typical) switching loss (mj/pulse) collector current i c (a) conditions: v cc = 300v v ge = 15v r g = 8.3? t j = 125c inductive load c snubber at bus esw(off) esw(on) switching loss vs. gate resistance (typical) switching loss (mj/pulse) gate resistance r g (?) 10 2 10 1 10 0 conditions: v cc = 300v v ge = 15v i c = 75a t j = 125c inductive load c snubber at bus esw(off) esw(on) 2 3 5 7 2 3 5 7 10 0 10 1 57 10 2 23 57 23 10 0 10 ? 10 ? 2 3 5 7 2 3 5 7 10 0 10 1 57 10 2 23 57 23 recovery loss vs. gate resistance (typical) recovery loss (mj/pulse) gate resistance r g (?) conditions: v cc = 300v v ge = 15v i e = 75a t j = 125c inductive load c snubber at bus err
feb. 2009 6 gate charge characteristics (typical) gate-emitter voltage v ge (v) gate charge q g (nc) v cc = 300v v cc = 200v i c = 75a 0 4 8 16 12 20 0 100 200 300 400 500 0 mitsubishi igbt modules CM75RL-12NF high power switching use
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